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| 1/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. hall ic series omnipolar detection hall ics (polarity detection for both s and n features dual outputs) bu52004gul, BU52014HFV description the bu52004gul and BU52014HFV are bipolar hall ics incorporating a polarity determination circuit that enables operation (output) on both the s- and n-poles, with the po larity judgment based on the out put processing configuration. these hall ic products can be in with movie, mobile phone and other applications involving crystal panels to detect the (front-back) location or determine t he rotational direction of the panel. features 1) omnipolar detection (polarity detection for both s and n features dual outputs) 2) micropower operation (small current using intermittent operation method) 3) ultra-compact csp4 package(bu52004gul) 4) small outline package (BU52014HFV) 5) line up of supply voltage for 1.8v power supply voltage (BU52014HFV) for 3.0v power supply voltage (bu52004gul) 6) polarity judgment and output on both poles (out1: s-pole output; out2: n-pole output) 7) high esd resistance 8kv(hbm) applications mobile phones, notebook computers, digital video camera, digital still camera, etc. product lineup product name supply voltage (v) operate point (mt) hysteresis (mt) period (ms) supply current (avg. ) ( a) output type package bu52004gul 2.40 3.30 +/-3.7 0.8 50 8.0 cmos vcsp50l1 BU52014HFV 1.65 3.30 +/-3.0 0.9 50 5.0 cmos hvsof5 plus is expressed on the s-pole; minus on the n-pole absolute maxi mum ratings bu52004gul (ta=25 ) parameters symbol limit unit power supply voltage v dd -0.1 ~ +4.5 1 v output current i out 1 ma power dissipation pd 420 2 mw operating temperature range topr -40 ~ +85 storage temperature range tstg -40 ~ +125 1. not to exceed pd 2. reduced by 4.20mw for each increase in ta of 1 over 25 (mounted on 50mm 58mm glass-epoxy pcb) bu52014 hfv (ta=25 ) parameters symbol limit unit power supply voltage v dd -0.1 ~ +4.5 3 v output current i out 0.5 ma power dissipation pd 536 4 mw operating temperature range topr -40 ~ +85 storage temperature range tstg -40 ~ +125 3. not to exceed pd 4. reduced by 5.36mw for each increase in ta of 1 over 25 (mounted on 70mm 70mm 1.6mm glass-epoxy pcb) no.10045edt01 downloaded from: http:///
bu52004gul, BU52014HFV technical note 2/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. magnetic, electrical characteristics bu52004gul (unless otherwise specified, v dd 3.0v, ta 25 ) parameters symbol limit unit conditions min typ max power supply voltage v dd 2.4 3.0 3.3 v operate point b ops - 3.7 5.5 mt output out1 (respond the south pole) b opn -5.5 -3.7 - output out2 (respond the north pole) release point b rps 0.8 2.9 - mt output out1 (respond the south pole) b rpn - -2.9 -0.8 output out2 (respond the north pole) hysteresis b hyss - 0.8 - mt b hysn - 0.8 - period t p - 50 100 ms output high voltage v oh v dd -0.4 - - v b rpn bu52004gul, BU52014HFV technical note 4/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. technical (reference) data bu52004gul (v dd =2.4v 3.3v type) BU52014HFV (v dd =1.65v 3.3v type) fig.6 bop,brp C ambient temperature fig.7 bop,brp C supply voltage fig.12 bop,brp C ambient temperature fig.13 bop,brp C supply voltage -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] bop s brp s brp n bop n v dd =3.0v -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 2 .02 .42 .83 .23 .6 supply voltage v magnetic flux density [mt] bop s brp s brp n bop n ta = 25c fig.10 i dd C ambient temperature 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =3.0v fig.11 i dd C supply voltage 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 2.0 2.4 2.8 3.2 3.6 supply voltage [v] average supply current [a] ta = 25c fig.8 t p C ambient temperature 40 45 50 55 60 65 70 75 80 85 90 95 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =3.0v fig.9 t p C supply voltage 0 10 20 30 40 50 60 70 80 90 100 2.0 2.4 2.8 3.2 3.6 supplly voltage[v] period [ms] ta = 25c -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] v dd =1.8v bop s brp s brp n bop n -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 . .8 . .6 . . supply voltage v magnetic flux density [mt] bop s brp s brp n bop n ta = 25c fig.16 i dd C ambient temperature 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =1.8v fig.17 i dd C supply voltage 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 supply voltage[v] average supply current [a] ta = 25c fig.14 t p C ambient temperature 0 10 20 30 40 50 60 70 80 90 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =1.8v fig.15 t p C supply voltage 0 10 20 30 40 50 60 70 80 90 100 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] period [ms] ta = 25c downloaded from: http:/// bu52004gul, BU52014HFV technical note 5/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. block diagram bu52004gul BU52014HFV pin no. pin name function comment a1 vdd power supply a2 gnd ground b1 out1 output( respond the south pole) b2 out2 output( respond the north pole) pin no. pin name function comment 1 out2 output ( respond the north pole) 2 gnd ground 3 n.c. open or short to gnd. 4 vdd power supply 5 out1 output ( respond the south pole) vdd dynamic offset cancellation sample & hold timing logic latch latch hall element a1 a2 b1 b2 vdd dynamic offset cancellation sample & hold timing logic latch latch hall element 4 2 5 1 0.1 f fig.18 fig.19 a1 b2 b1 a2 reverse a2 b2 b1 a1 surface reverse 1 2 5 3 3 surface 1 4 5 2 4 the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. 0.1f the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. downloaded from: http:/// bu52004gul, BU52014HFV technical note 6/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. description of operations micropower operation (small current using intermittent action) (offset cancelation) (magnetic field detection mechanism) the dual output bipolar detection hall ic adopts an intermittent operation method to save energy. at startup, the hall elements, amp, comparator and other detection circuits power on and magnetic detection begins. during standby, the detection circuits power off, thereby reducing current consumption. the detection results are held while standby is active, and then output. reference period: 50ms (max100ms) reference startup time: 48 s i dd standby startup time period 50ms t fig.20 the hall elements form an equivalent wheatstone (resistor) bridge circuit. offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. a dynamic offset cancellation circuit is employed to cancel this offset voltage. when hall elements are connected as shown in fig. 21 and a magnetic field is applied perpend icular to the hall elements, voltage is generated at the mid- point terminal of the bridge. this is known as hall voltage. dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 ? angle from its original path, and thereby cancels the hall voltage. the magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. gnd v dd i b hall voltage fig.21 the hall ic cannot detect magnetic fields that run horizontal to the package top layer. be certain to configure the hall ic so that the magnetic field is perpendicular to the top layer. fig.22 s s n s n s n flux direction flux direction downloaded from: http:/// bu52004gul, BU52014HFV technical note 7/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. the out1 pin detects and outputs for the s-pole only. sinc e it is unipolar, it does not recognize the n-pole. the out2 pin detects and outputs for the n-pole only. sinc e it is unipolar, it does not recognize the s-pole. the dual output omnipolar detection hall ic detects magnetic fields running perpendicular to the top surface of the package. there is an inverse relationship between magnetic flux densit y and the distance separating the magnet and the hall ic: when distance increases magnetic density falls. when it drop s below the operate point (bop), output goes high. when the magnet gets closer to the ic and magnetic density rises, to the operate point, the output switches low. in low output mode, the distance from the magnet to t he ic increases again until the magnetic dens ity falls to a point just below bop, and output returns high. (this point, where magnetic flux density restores high output, is known as the release point, brp.) this detection and adjustment mechanism is designed to prev ent noise, oscillation and other erratic system operation. flux b low brp s bop s 0 high n-pole magnetic flux density [mt] flux high high out 1[v] n n s s s n s-pole out1 fig.23 s-pole detection flux b bop n brp n 0 high n-pole magnetic density [mt] fig.24 n-pole detection flux high high low out 2[v] n n s s s n s-pole out2 downloaded from: http:/// bu52004gul, BU52014HFV technical note 8/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. intermittent operation at power on the dual output omnipolar detection hall ic adopts an intermittent operation method in detecting the magnetic field during startup, as shown in fig. 25. it outputs to the appropriate terminal based on the det ection result and maintains the output condition during the standby period. the time from power on unt il the end of the initial start up period is an indefinite interv al, but it cannot exceed the maximum period, 100ms. to accommodate the system de sign, the hall ic output read should be programmed within 100ms of power on, but after the time allo wed for the period ambient temperature and supply voltage. magnet selection of the two representative varieties of permanent magnet, neodym ium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment applications. fig. 26 shows the relation between the size (volum e) of a neodymium magnet and magnetic flux density. the graph plots the correlation between the distance (l) from thr ee versions of a 4mm x 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. fig. 27 shows hall ic detection distance C a good guide for determining the proper size and detecti on distance of the magnet. based on the BU52014HFV operating point max 5.0 mt, the minimum detection distance for the 1mm, 2mm and 3mm m agnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. to increase the magnets detection distance, either increase its thickness or sectional area. x=y=4mm t=1mm,2mm,3mm x t y flux density measuring point l: variable t fig.27 magnet dimensions and flux density measuring point magnet size magnet power on vdd startup time standby time standby time startup time (intermittent action) indefinite out (no magnetic field present) indefinite out (magnetic field present) low high supply current fig.25 0 1 2 3 4 5 6 7 8 9 10 024681 01 21 41 61 82 0 i [] i i[] fig.26 7.6mm t=3mm t=1mm t=2mm 9.2mm 10.4mm magnet material: neomax-44h (material) maker: neomax co.,ltd. downloaded from: http:/// bu52004gul, BU52014HFV technical note 9/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. position of the hall effect ic(reference) footprint dimensions (optimize f ootprint dimensions to the board design and soldering condition) strings size(typ) e 0.50 b3 0.25 sd 0.25 se 0.25 terminal equivalent circuit diagram gnd vdd out1, out2 because they are configured for cmos (inverter) output, the output pins require no external resistance and allow direct connection to the pc. this, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. fig.28 (unit mm) (unit mm) 0.55 0.55 0.35 vcsp50l1 0.6 0.8 0.2 hvsof5 hvsof5 vcsp50l1 downloaded from: http:/// bu52004gul, BU52014HFV technical note 10/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. operation notes 1) absolute ma ximum ratings exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the ic. because the source (short mode or open mode) cannot be ident ified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) gnd voltage make sure that the gnd terminal potential is maintained at the minimum in any oper ating state, and is always kept lower than the potential of all other pins. 3) thermal design use a thermal design that allows for sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) pin shorts and mounting errors use caution when positioning the ic for mounting on printed circuit boards. mounting e rrors, such as improper positioning or orientation, may damage or destroy the device. the ic may also be damaged or destroyed if output pins are shorted together, or if shorts occur between t he output pin and supply pin or gnd. 5) positioning components in proximity to the hall ic and magnet positioning magnetic components in close proximity to the hall ic or magnet may alter the magn etic field, and therefore the magnetic detection operation. thus, plac ing magnetic components near the hall ic and magnet should be avoided in the design if possible. however, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic co mponent(s) in place to verify normal op eration before implem enting the design. 6) slide-by position sensing fig.29 depicts the slide-by configuration employed for positio n sensing. note that when t he gap (d) between the magnet and the hall ic is narrowed, the reverse magnetic field generated by the magnet can cause the ic to malfunction. as seen in fig.30, the magnetic field runs in opposite directions at point a and point b. since the dual output omnipolar detection hall ic can detect the s-pole at point a and the n- pole at point b, it can wind up switching output on as the magnet slides by in the process of position detecti on. fig. 31 plots magnetic flux density duri ng the magnet slide-by. although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. this demonstrates that sli ghtly widening the gap (d) between the magnet and hall ic reduces the reverse magnetic field and prevents malfunctions. 7) operation in strong electromagnetic fields exercise extreme caution about using the device in the presence of a strong electr omagnetic field, as such use may cause the ic to malfunction. 8) common impedance make sure that the power supply and gnd wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. also, take measures to minimize ripple such as using an inductor or capacitor. 9) gnd wiring pattern when both a small-signal gnd and high-current gnd are provided, single-point groundi ng at the reference point of the set pcb is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-si gnal gnd. in the same way, care must also be taken to avoid wiring pattern fluctuat ions in the gnd wiring pattern of external components. 10) exposure to strong light exposure to halogen lamps, uv and other st rong light sources may cause the ic to malf unction. if the ic is subject to such exposure, provide a shield or take other measures to protect it from the ligh t. in testing, exposure to white led and fluorescent light sources was shown to have no significant effect on the ic. 1 1) power source design since the ic performs intermittent operatio n, it has peak current when its on. pl ease taking that into account and under examine adequate evaluations when designing the power source. l fig.29 d magnet hall ic slide -10 -8 -6 -4 -2 0 2 4 6 8 10 012345678910 horizontal distance from the magnet [mm] magnetic fux density[mt] reverse fig.31 fig.30 b s a n flux flux downloaded from: http:/// bu52004gul, BU52014HFV technical note 11/11 www.rohm.com 2010.01 - rev.d ? 2010 rohm co., ltd. all rights reserved. ordering part number b u 5 2 0 0 4 g u l - e 2 part no. part no. 52004 52014 package gul: vcsp50l1 hfv: hvsof5 packaging and forming specification e2: embossed tape and reel (vscp50l1) tr: embossed tape and reel (hvsof5) (unit : mm) hvsof5 s 0.08 m 0.1 s 4 321 5 (0.05) 1.6 0.05 1.0 0.05 1.6 0.05 1.2 0.05 (max 1.28 include burr) 45 32 1 (0.8) (0.91) (0.3) (0.41) 0.2max 0.13 0.05 0.22 0.05 0.6max 0.5 0.02 +0.03C0.02 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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